KONISHI-Bond.com

Adhesive & Sealant

KONISHI FOR INDUSTRIAL APPLICATION - ELECTRICAL & ELECTRONICS


KONISHI SERIES SL/FB is designed for use for electrical and electronics applications
:

1. Special Features : Elastic - Fast curing - Shock resistant - Solventless - Free from low molecular weight cyclic siloxanes - Adhesive to a variety of adherends


SL220W
Bond SL220W silyl group-terminated polymer-based adhesive 120ml, 333ml

APPLICATIONS :
It can be used for bonding various materials. Polycarbonate, metals, & rigid plastics such as ABS resin.
For adhesion that requires initial bond strength
Adhesion of different hard materials with different thermal expansion cofficient
Adhesion of parts that are subjected to shock and vibration

FEATURES :
Fast curing.
Do not use a tin compound.
Curing at room temperature
RoHS Compliant
Polysiloxane free: contains no cyclic polysiloxane low molecular generating a contact fault.
Can also be used for filling adhesive (internal curing will take time).
Small distortion, strong cold thermal shock.

SPECIAL CHARACTERISTICS :
Viscosity 90~200 Pa.s (23°C)

COLOR  : White


FB500W
FB500ZW silicone-modified polymer-based adhesive 120ml, 333ml

APPLICATIONS :
Adhesive for Electrical and Electronic components

FEATURE : Flame retardant. Do not use Tin compound

PACKAGING : 120ml, 333ml

CHARACTERISICS : Viscosity 50~150Pa.s (23°C)

COLOR : White
SL820W
SL820W Silyl group-terminated Polymer-based Adhesive 120ml, 333ml

APPLICATIONS :
It can be used for bonding various materials. Polycarbonate, metals, & rigid plastics such as ABS resin.
For adhesion that requires initial bond strength
Adhesion of different hard materials with different thermal expansion cofficient
Adhesion of parts that are subjected to shock and vibration

FEATURES:
Fast curing
Do not use dibutyltin compounds
Curing at room temperature
RoHS compliant
Polysiloxane free
Can be used as filling adhesive
Small distortion ; withstand strong cold thermal shock

SPECIAL CHARACTERISTICS :
Viscosity 70~150 Pa.s (23°C)






SPECIFICATIONS FOR BOND SL / FB SERIES

Product Name SL210 (B/W)
SL210C
SL220 (B/W) SL220LB
Features Ultra-fast curing
Transparent
Ultra-fast curing
Fast curing
Low viscosity
Fast curing
Free from Tin Compounds
Primary Component
Silane terminated polymer
Appearance B: Black paste
W:White paste
Transparent
paste
B: Black paste
W:White paste
B: Black paste
Viscosity (Pa.s/23°C) 50~100 25~50 90~200 15~30
Specific gravity (g/cm3) 1.20~1.30 0.95~1.05 1.20~1.30 1.10~1.20
Skinning Time (min)
2~5 0.5~3 6~15 4~9
Tensile lap shear strength (N/mm2)
Stainless steel/ Stainless steel
3.75 4.90 4.35 3.35
Tensile lap shear strength (N/mm2)
ABS/ ABS
2.5 4.8 3.92 2.79
Tensile lap shear strength (N/mm2)
Polycarbonate/ Polycarbonatel
2.59
3.80
2.13
2.73
Durometer hardness 23°C 50
40
50
48
Max Tensile Stress (N/mm2)
4.5 3.0 5.3 5.5
Elongation at break (%)
275
155 275 300
Volume resistivity (ohm.cm)
1.7x1012 3.3x1012 1.8x1012 1.3x1012
Thermal Conductivity (W/m.K)
0.24
0.14
0.22
0.20
Dielectric constant 1MHz
4.91
4.06
4.89
4.75
Dielectric dissipation factor 1MHz
0.046
0.046
0.049
0.044
Flame resistance standards
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Volume 120ml,
333ml
333ml 120ml, 333ml 120ml,
333ml


SPECIFICATIONS FOR BOND SL/ FB SERIES

Product Name SL820 (B/W)
SL420H (B/W)
FB500Z (B/W) FB500H (B/W)
Features Fast curing
High Heat
Resistance
High viscosity
Flame retardant
UL94 V-0 certified
Flame retardant
High viscosity
UL94 V-0 certified
Free from dibutyltin Compounds
Free from Tin compounds
Primary Component
Silane terminated polymer
Silicone modified polymer
Appearance B: Black paste
W:White paste
B: Black paste
W:White paste
B: Black paste
W:White paste
B: Black paste
W:White paste
Viscosity (Pa.s/23°C) 70~150 150~300 50~150 150~300
Specific gravity (g/cm3) 1.20~1.30 1.23~1.33 1.52~1.62 1.59~1.69
Skinning Time (min)
8~16 8~16 5~15 5~15
Tensile lap shear strength (N/mm2)
Stainless steel/ Stainless steel
2.43
1.96 2.85 2.15
Tensile lap shear strength (N/mm2)
ABS/ ABS
2.39 1.81 2.05 1.71
Tensile lap shear strength (N/mm2)
Polycarbonate/ Polycarbonatel
2.69
1.80
1.97
1.63
Durometer hardness 23°C 40
56
85
90
Max Tensile Stress (N/mm2)
3.0 2.6 3.9
4.4
Elongation at break (%)
380 112 50 30
Volume resistivity (ohm.cm)
1.2x1012 8.3x1012 1.1x1012 0.8x1012
Thermal Conductivity (W/m.K)
0.23
0.28
0.95
1.53
Dielectric constant 1MHz
5.41
5.52
5.80
5.84
Dielectric dissipation factor 1MHz
0.044
0.059
0.035
0.038
Flame resistance standards
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--
UL94 V-0
UL94 V-0
Volume 120ml,
333ml
120ml, 333ml
120ml, 333ml 120ml,
333ml